Intel's 10nm Super Fin technology
GPTKB entity
Statements (63)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:Company
|
| gptkbp:bfsLayer |
5
|
| gptkbp:bfsParent |
gptkb:Tiger_Lake_microarchitecture
gptkb:Xe_graphics_architecture |
| gptkbp:based_on |
gptkb:Super_Fin_process_technology
|
| gptkbp:competes_with |
gptkb:AMD's_7nm_technology
|
| gptkbp:developed_by |
gptkb:Intel_Corporation
|
| gptkbp:enables |
better thermal performance
|
| gptkbp:enhances |
gptkb:benchmark
|
| gptkbp:features |
gptkb:Fin_FET_transistors
|
| gptkbp:first_introduced |
gptkb:Intel_Core_processors
|
| https://www.w3.org/2000/01/rdf-schema#label |
Intel's 10nm Super Fin technology
|
| gptkbp:improves |
clock speeds
power efficiency |
| gptkbp:is_a |
leading-edge technology
advanced manufacturing process critical component for Intel's growth key technology for Intel node technology strategic initiative for Intel successor to 14nm technology |
| gptkbp:is_aimed_at |
gptkb:smartphone
gptkb:High_School |
| gptkbp:is_associated_with |
Intel's manufacturing facilities
|
| gptkbp:is_characterized_by |
high performance per watt
advanced lithography techniques lower thermal output improved yield rates |
| gptkbp:is_compatible_with |
gptkb:x86_architecture
|
| gptkbp:is_designed_for |
high-performance computing
data-intensive tasks high-end applications |
| gptkbp:is_designed_to |
maximize performance
support next-generation applications meet increasing demand for performance |
| gptkbp:is_evaluated_by |
performance benchmarks
|
| gptkbp:is_expected_to |
enhance user experience
drive future innovations reduce manufacturing costs improve market share lead to 7nm technology |
| gptkbp:is_influenced_by |
industry trends
|
| gptkbp:is_part_of |
gptkb:Intel's_10th_generation_processors
Intel's process technology roadmap Intel's technology portfolio Intel's research and development efforts Intel's competitive strategy Intel's future product lines |
| gptkbp:is_recognized_by |
a breakthrough in chip technology
a significant advancement in fabrication technology |
| gptkbp:is_recognized_for |
innovation in semiconductor design
enhanced scalability |
| gptkbp:is_used_in |
gaming P Cs
|
| gptkbp:is_utilized_in |
gptkb:Cloud_Computing_Service
data centers embedded systems artificial intelligence applications |
| gptkbp:offers |
higher transistor density
|
| gptkbp:reduces |
power consumption
leakage current |
| gptkbp:released_in |
gptkb:2018
|
| gptkbp:supports |
AI workloads
|
| gptkbp:used_in |
gptkb:microprocessor
|