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gptkbp:instance_of
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gptkb:microprocessor
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|
gptkbp:application
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gptkb:political_movement
computational fluid dynamics
climate modeling
molecular dynamics
nuclear simulations
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|
gptkbp:architectural_style
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MIMD
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gptkbp:availability
|
limited availability
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gptkbp:cache_size
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up to 8 MB per processor
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gptkbp:connects
|
Cray T3 E interconnect
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gptkbp:cooling_system
|
air-cooled
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gptkbp:data_usage
|
up to 1 GB/s
|
|
gptkbp:depth
|
1.2 m
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|
gptkbp:end_date
|
gptkb:2005
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gptkbp:form_factor
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rack-mounted
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gptkbp:height
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1.8 m
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|
https://www.w3.org/2000/01/rdf-schema#label
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Cray T3 E-900
|
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gptkbp:input_output
|
gptkb:Cray_T3_EI/_O_subsystem
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gptkbp:involved_units
|
1.2 TFLOPS
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|
gptkbp:is_scalable
|
high scalability
|
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gptkbp:language
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gptkb:C
gptkb:C++
gptkb:Fortran
|
|
gptkbp:legacy
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gptkb:Cray_T3_E_series
|
|
gptkbp:manufacturer
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gptkb:Cray_Inc.
|
|
gptkbp:market_segment
|
high-performance computing
|
|
gptkbp:network
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gptkb:Gigabit_Ethernet
|
|
gptkbp:notable_features
|
modular design
advanced cooling technology
shared memory architecture
large memory capacity
high bandwidth interconnect
|
|
gptkbp:notable_users
|
gptkb:Los_Alamos_National_Laboratory
|
|
gptkbp:number_of_cores
|
512
|
|
gptkbp:operating_system
|
gptkb:UNIX
|
|
gptkbp:performance
|
up to 1.2 TFLOPS
600 GFLOPS
|
|
gptkbp:power_consumption
|
up to 30 k W
|
|
gptkbp:predecessor
|
gptkb:Cray_T3_D
|
|
gptkbp:processor
|
gptkb:DEC_Alpha
|
|
gptkbp:produced_by
|
discontinued
|
|
gptkbp:ram
|
up to 16 GB per node
|
|
gptkbp:release_year
|
gptkb:1995
|
|
gptkbp:reliability
|
high reliability
|
|
gptkbp:storage
|
up to 1 TB
|
|
gptkbp:successor
|
gptkb:Cray_T3_E-1200
|
|
gptkbp:used_in
|
gptkb:Research_Institute
|
|
gptkbp:user_interface
|
command line interface
|
|
gptkbp:weight
|
approximately 1,500 kg
|
|
gptkbp:width
|
0.6 m
|
|
gptkbp:bfsParent
|
gptkb:Cray_T3_E
|
|
gptkbp:bfsLayer
|
5
|