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gptkbp:instance_of
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gptkb:microprocessor
|
|
gptkbp:architecture
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distributed memory
|
|
gptkbp:bus_connections
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gptkb:VMEbus
|
|
gptkbp:connects
|
3 D torus
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|
gptkbp:cooling_system
|
air cooling
|
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gptkbp:form_factor
|
rack-mounted
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gptkbp:has_website
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scientific computing
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|
https://www.w3.org/2000/01/rdf-schema#label
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Cray T3 D
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gptkbp:language_support
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gptkb:C
gptkb:C++
gptkb:Fortran
|
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gptkbp:legacy
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gptkb:Cray_C90
gptkb:Cray_Y-MP
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gptkbp:manufacturer
|
gptkb:Cray_Inc.
|
|
gptkbp:market_segment
|
high-performance computing
|
|
gptkbp:maximum_performance
|
1.2 GFLOPS
|
|
gptkbp:memory_type
|
gptkb:SDRAM
|
|
gptkbp:notable_feature
|
fault tolerance
low latency
parallel processing
scalability
high throughput
high-speed interconnects
large memory capacity
|
|
gptkbp:notable_project
|
Weather forecasting
Financial modeling
Climate modeling
Astrophysics research
Molecular dynamics simulations
Material science research
Engineering simulations
Nuclear simulations
Biological simulations
Fluid dynamics simulations
|
|
gptkbp:notable_users
|
gptkb:Los_Alamos_National_Laboratory
|
|
gptkbp:operating_system
|
gptkb:UNIX
|
|
gptkbp:power_consumption
|
up to 50 k W
|
|
gptkbp:price
|
$10 million
|
|
gptkbp:processor
|
gptkb:DEC_Alpha
up to 512
|
|
gptkbp:release_year
|
gptkb:1995
|
|
gptkbp:successor
|
gptkb:Cray_T3_E
|
|
gptkbp:weight
|
approximately 10 tons
|
|
gptkbp:bfsParent
|
gptkb:Cray_Y-MP
|
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gptkbp:bfsLayer
|
6
|